NANO ASMPT Die Bonder and Flip Chip Bonder

Feature

●Accuracy ± 0.3 µm @ 3s

●Support all die bonding and polycrystalline applications

●High-precision alignment of optical components

●Vibration reduction system

●Automatic placement and offset adjustment system

●High-precision 300 mm die bonding table

●Dynamic calibration system

●Quantitative parallelism calibration

●In-situ eutectic bonding ability

●Three different heating options, including laser welding system

●Active die bond strength control, from 0.1 to 20N

●Glue/spray glue solid crystal

●UV curing function is provided on the solid crystal table

●Post-bonding inspection and wafer positioning software

●The clean room is equipped with HEPA filter and static eliminator

●The machine is designed in modular form

Size

Width, depth and height

1690 x 1430 x 2040 mm