Lotus-SD Plus Automatic Soft Solder Die Bonder

Feature

High-speed die bonding: up to 6,500 per hour*

Large 8” wafer processing capacity

Single-row lead frame processing capacity

Excellent production quality

Programmable temperature control zone

Intelligent heating rail design

Adopting the design of rotating nozzle to make corrections synchronously during die bonding

Size

Width, depth and height 1823 x 1200 x 2057 mm³