LS100-2 Automatic Laser Scribing System

Feature

●Specially cut sapphire substrate or metal substrate

●Dual worktable design to improve the utilization rate of laser head

●Fully automatic wafer processing system

●Can process up to 50 wafers

●Maximum 4" wafer processing capacity

●Advanced image recognition capabilities

●Edge detection

●Cut width inspection

●Multi-point height measurement (patent pending)

●Processing of non-complete wafers

Size

Width, depth and height

2,080 x 1,270 x 2,080 mm³