LASER1205 UV Dicingᵖˡᵘˢ System

Feature

●Capable of cutting DAF and FOW substrates. Cutting thickness range: 10 µm-200 µm

●Ultra-high positioning accuracy and repeatability (< ± 1 µm)

●Very narrow cutting width (< 12 µm @ 100 µm thickness)

●Small heat affected zone (2 .. 3 µm @ 100 µm thickness)

●New laser material processing system design to achieve higher UPH (50% faster than similar products)

●Save feeding time

●Double material box design

●Double coating and cleaning system

Size

Width, depth and height

2,080 x 1,270 x 2,080 mm³