ORCAS Series ASMPT Encapsulation Solution for Large Format Packaging

Feature

●Independent packaging equipment, also suitable for die up and die down wafer level and substrate packaging

●Suitable for KOZ and overmold products

●Powder and liquid encapsulation resin can be used. Automatic control of dispensing and powder coating method, speed and shape, the accuracy can reach ±1%

●Use non-polluting separation film in the packaging to ensure that the mold is clean throughout the process

●Innovative technology is applied to the production line, fully automatic processing of 12-inch (without wafer ring) or 8-inch (with wafer ring) wafer products

Size

Width, depth and height

2470 x 4020 x 2230 mm³