AD50Lite ASMPT Automatic Die Bonding System

Feature

●Dry die cycle only: 47ms

●According to ASMPT internal testing standards

●Excellent bonding performance

●XY position accuracy: ± 38.1 µm (± 1.5 mil)

●Chip angle accuracy: ± 5°

●Small chip processing capacity-as small as 4mil

●Save production cost

●Using linear motors, greatly saving maintenance costs

●Power saving, low energy consumption

●High production area ratio, more effective use of plant space

●Fully automated production, saving human resources

●Automatic material handling capacity

●Longer MTBA

Size

Width, depth and height

1160 x 1040 x 1480 mm³