SD8312 Automatic Soft Solder Die Bonding System

Feature

●The new generation SD8312 series establishes a new standard for 12" soft tin die bonding

●Universal work table design, which can handle high-density lead frames

●High-speed die bonder combining innovative high technology and mature technology

●Precisely control the oxygen level during die bonding

●AB wafer processing capacity

Size

Width, depth and height

1,950 x 1,600 x 1,400 mm³