Photon Automatic High Precision Die Attach System

Feature

●Accuracy ± 3 µm @ 3s

●Glue/spray glue solid crystal

●Automatic nozzle replacement capability (up to 6 nozzles)

●Multi-needle thimble system, which can handle different size wafers

●Trace the source of materials and strengthen quality control

●Patented welding head design

●Options

●Polycrystal ability

●UV curing

Size

Width, depth and height

2,150 x 1,400 x 2,300 mm