Eagle AERO ASM For High-end IC Applications

Feature

Excellent performance

●UPH increased by up to 30%

●In traditional copper wire applications

●Ball size up to 22 μm

●Professional engineering design reduces the ball diameter to 22 μm under 0.5mil wire diameter

●Applicable to 30µm

●Other features include

●Preset gold wire (Au) wire bonding device, upgradeable optional copper wire (Cu) / alloy wire (CuPd) / silver wire (Ag) wire bonding device

Size

Width, depth and height

1,200 x 990 x 1,760mm³