Best Soon Technology Co., Ltd.
Specializing in semiconductor packaging equipment, materials and related technology service
CH / EN
Tel:+86 139 2573 3686
E-mail:sales@bestsoon-china.com
Mobile:+86-755-23016560
website:www.bestsoon-china.com
Address:Room 613, Building 2, Vanke Star City Commercial Center, Shangxing Road, Shangxing Community, Xinqia
AD819 Series Fully Automatic ASMPT Bonding System
Feature
●TO-can packaging processing capacity
●Accuracy ± 15 µm @ 3s
● Eutectic die bonding process (AD819-LD)
●Dispensing and bonding process (AD819-PD)
Automatic Soft Solder Die Bonding System
ASMPT Automatic Die Bonding System (12” wafer handling)
Automatic Die Bonding System (8” wafer handling)
ASMPT Automatic Die Bonder
Company Name :
Shenzhen Bestsoon ElectronicTechnology Co., Ltd.
Contact number:+86-755-23016560
Tel:+86 139 2573 3686 ( Zhao)
+86 137 9879 5391 ( Huang)
+86 133 0291 7860 (Yang )
Fax: +86-755-23016560
Address:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen
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