AD830P-Plus ASMPT Automatic Die Bonder

Feature

●High-speed, high-precision die bonding

●Polycrystalline LED processing capability

●Top-view lens to identify the PN electrode at the bottom of the chip

●Poly crystal arm module (option)

●Brand new image recognition system

●At the time of glue dispensing and die bonding, image recognition and inspection are carried out at the same time to improve production efficiency

●"PR On The Fly" top-view image recognition capability, which can improve the precision of die bonding position without losing the die bonding cycle time

●Option: Downward-looking lens for double-sided image inspection of the chip

●Realize factory automation

●Fully automatic material handling capability

●Fully automatic wafer handling system (option)

●Connectivity (option)

Size

Width, depth and height

1,740 x 1,240 x 2,080mm