AD830 Plus-R Automatic Epoxy Die Attach System (6” wafer handling)

Feature

●Patented welding head design

●High-density lead frame processing capability

●Using arranging optical system to further increase the die bonding speed

●A full-color camera equipped with white light LED lighting, which can handle different substrates

●Tape and reel material handling capacity (only applicable to AD830Plus-R)

●8” wafer processing capacity (option)

Size

Width, depth and height

1,740 x 1,240 x 2,080mm³