AD8312 Plus Series ASMPT Automatic Die Bonding System (12” wafer handling)

Feature

●The new generation of high-capacity AD8312 series die bonder sets a new standard for the industry

●Universal work table design, suitable for processing high-density lead frames

●A variety of configurations are available to cater for the different needs of the market

●AD8312Plus: High-speed die bonder combining innovative high technology and mature technology

●AD8312SD: Large chip solution

●AD8312FC: Support flip chip and direct die bonding process

Size

Width, depth and height

2,260 x 1,580 x 2,060 mm³