AD50Pro ASMPT Automatic Die Bonding System

Feature

●High-speed die bonding: 50 ms die bonding cycle*

●Excellent bonding performance

●XY position accuracy: ± 25 µm @ 3σ*

●Chip angle accuracy: ± 3° *

●Small chip processing capacity-as small as 3mil

●Save production cost

●Directly send the film, save the cost of the carrier

●Using linear motors, greatly saving maintenance costs

●Power saving, low energy consumption

●High production area ratio, more effective use of plant space

●Fully automated production, saving human resources

●Automatic material handling capacity

●Automatic wafer loading and unloading system (option)

Size

Width, depth and height

1570 x 1160 x 2057 mm³