FORCE VECTOR The Component Tacking Tool for Silver (Ag) Sintering

Feature

● Wafer and component tracking for silver sintering process

●Silver film stamping

●Automatic processing of silver film for HVM

●Configuration of hot pressing (TC) die-bonding head

●The heating capacity of the die-bonding table

●High bonding strength

●Silver sintering material processing

●Flexible MCM function

●Ejector, pick-up and die attach nozzle

●Flexible chip and component input format: wafer | TnR | format tray | JEDEC tray

●Automatic tool change system

●Thin wafer handling capacity

Size

Width, depth and height

1750 x 2160 x 2260 mm³