AEROCAM Series A New Dimension of Wire Bonding

Feature

●30% UPH improvement

●Based on typical copper wire applications

●22μm wire bond ball

●Expert-level skills, in the case of 0.5mil wire, the wire bond ball can be as small as 22μm

●High-end applications of ultra-fine 30μm solder joints

Other configurations adapted to the market

●AEROCAM-G

●AEROCAM-I

Size

Width, depth and height

1284 x 1550 x 1760 mm³