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IC Packaging Solutions

2019-08-19 00:00:00
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IC Packaging Solutions
Content:

ASMPT complete wafer-level and panel-level packaging production solutions, including high-precision large-scale pick-and-place, plastic packaging, solder paste printing, solder ball discharge, device separation, inspection, testing and packaging.


Serial numberProcessRelated Products
①

Chip pick and place

Chip pick and place

NUCLEUS


SIPLACE CA

②

Plastic package

Plastic package

ORCAS

③

Solder paste printing

Solder paste printing

DEK Galaxy

④


Solder ball discharge

Solder ball discharge

DEK Galaxy

⑤

Device separation

Device separation

LASER1205

⑥

Inspection, testing and packaging

Inspection, testing and packaging

SUNBIRD


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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

      Futengying Intelligent Equipment Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen

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